#x0201c;压电片-粘结层-主体结构#x0201d;动力耦合模型研究

STUDY ON THE COUPLED MODEL OF #x0201c;PZT CHIP-ADHESIVE LAYER-MAIN STRUCTURE#x0201d;

  • 摘要: 利用机电阻抗(EMI)识别结构损伤的技术已在航空航天、机械工程、土木工程等领域成功应用,与现阶段的应用相比,其理论研究和数值分析相对滞后。为获得PZT工作过程的数学模型,在研究现有的#x0201c;压电片-粘结层-主体结构#x0201d;耦合模型的基础上,提出了一种新的EMI耦合计算模型。通过建立模型成立的假设条件,对模型计算全过程进行了理论推导,获得了电导纳公式。此模型的建立丰富了压电阻抗技术的理论研究成果,为开展相关研究提供了参考。

     

    Abstract: The EMI technique, as a structural damage detection (SDD) technique, has been successfully applied in fields of aviation, mechanical engineering and civil engineering. However, compared with its application in recent years, the study on the theory and numeric is lagged behind. To avoid the theoretical lack in the application of EMI technique, in this paper, the author puts forward a new coupled model of #x0201c;PZT chip-adhesive layer-main structure (PAS)#x0201d;, which bases on recent several PAS models. By constructing the assumptions of the simplified model and deducing the overall procedure of theoretical calculation, we get the admittance formulation. This new EMI coupled model has a higher degree of accuracy and considers more factors including damping, which provides a reference for deeper theoretical study of EMI technique and a new clue for further study.

     

/

返回文章
返回