杨忠汉. 三维光弹性内部应力全场分析在微机上的应用[J]. 工程力学, 1987, 4(2): 85-91.
引用本文: 杨忠汉. 三维光弹性内部应力全场分析在微机上的应用[J]. 工程力学, 1987, 4(2): 85-91.
Yang ZhongHan. Application In Minicomputer of Whole-Field Stress Analysis of 3-D Photoelasticity[J]. Engineering Mechanics, 1987, 4(2): 85-91.
Citation: Yang ZhongHan. Application In Minicomputer of Whole-Field Stress Analysis of 3-D Photoelasticity[J]. Engineering Mechanics, 1987, 4(2): 85-91.

三维光弹性内部应力全场分析在微机上的应用

Application In Minicomputer of Whole-Field Stress Analysis of 3-D Photoelasticity

  • 摘要: 本文将三维光弹的分析和数值计算相结合,提供了全场应力分析的一种实用方法,在此方法中,将偏微分方程转化为差分迭代公式,据此编制了计算程序,并在IBM-PC-XT微机上实现。通过对无柱帽无梁楼盖试验数据的计算,证明这种方法是有效的。三维光弹应力全场分析的计算,是运用电子计算机进行数值计算,其基本原理,参见参考文献。下面对无柱帽无梁楼盖全场应力分析的计算机FORTRAN程序,作一简单介绍,此程序已在 IBM-PC-XT 微机上实现。

     

    Abstract: This paper discusses a new,practical method of whole-field stress analysis provided through the combination of 3-D photoelasticity analysis and numerical calculation,that is,partial-differential equations,after being converted into difference iteration formulae,to be programmed and realized in IBM-PC-XT minicomputer.The method proved effective by the 3-D photoelasticity calculation of the experimental data obtained from a girderless floor structure,without column cap.

     

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