STRESS ANALYSIS OF CRACKED PLATE WITH ADHESIVELY BONDING

In thes paper, Body Force Method (BFM) with special fundamental soluhons and resultant bountw condihons is employed to analyze the problem of an adhesively bondedcracked plate. A shear sghng model, which sahsfies the continuous displacement condihons of the adhesive layer, is adopted to render the problem into the analysis of the cracked plate and the patch, under the achon of distributed forces along boundaries and the adhesive shear stresses.Since the special solutions satisfy the trachve-free condihons of the surface of the crack, the discretizations of the crack surface are not required and the exact distribution of stress near the crack tip is obtained. With the analgtical solutions of the Stress Inensity Factors at the crack tip due to a point force, the adhesively bonding effect represented by the reduchon of SIF at the crack tip is obtalned easily and accurately with less computational effort. As an example of crack patching, a center-cracked plate with a bonded patch subjected to remote in-plane forces is studied. The SIF of the crack tip after repairing is calculated to verify the effect of the adhesively patching method. The distribution of adhesive shear stress in the patched domaln is giveir The induences of the thickness, elastic constants and size of the patch on the SIF are discussed.