JUDGEMENT OF IN-PLANE/OUT-OF-PLANE MICROBUCKLING MODE FOR PACKAGED UNIDIRECTIONAL EMC LAMINATES

Elastic memory composite (EMC) materials are a new class of functional materials and have great potential applications in future space deployable structures due to their advantages of high failure strain, high specific modulus, and low density. At elevated temperature, the matrix of EMC laminates is in a rubbery state and its very low shear modulus cannot provide an effective constraint for the fibers. Hence, EMC laminates can realize a large packaging strain through the microbuckling of compressed fibres under bending. In this study, according to the principle of minimum potential energy, the total potential energies of EMC laminates are respectively calculated under in-plane and out-of-plane microbuckling modes. Considering that the real microbuckling mode should be the one that produces lower total potential energy, the theoretical microbuckling mode of unidirectional EMC laminates is determined under bending and is agreeable with the testing results.