田振国, 马世麟, 白象忠, 付宇明. 多裂纹导电薄板电热温度场和应力场的计算[J]. 工程力学, 2003, 20(5): 70-75.
引用本文: 田振国, 马世麟, 白象忠, 付宇明. 多裂纹导电薄板电热温度场和应力场的计算[J]. 工程力学, 2003, 20(5): 70-75.
TIAN Zhen-guo, MA Shi-lin, BAI Xiang-zhong, FU Yu-ming. CALCULATION OF THE ELECTROTHERMAL TEMPERATURE AND STRESS FIELDS IN A CONDUCTIVE THIN PLATE WITH MULTIPLE CRACKS[J]. Engineering Mechanics, 2003, 20(5): 70-75.
Citation: TIAN Zhen-guo, MA Shi-lin, BAI Xiang-zhong, FU Yu-ming. CALCULATION OF THE ELECTROTHERMAL TEMPERATURE AND STRESS FIELDS IN A CONDUCTIVE THIN PLATE WITH MULTIPLE CRACKS[J]. Engineering Mechanics, 2003, 20(5): 70-75.

多裂纹导电薄板电热温度场和应力场的计算

CALCULATION OF THE ELECTROTHERMAL TEMPERATURE AND STRESS FIELDS IN A CONDUCTIVE THIN PLATE WITH MULTIPLE CRACKS

  • 摘要: 讨论了对带有n个共线裂纹的薄板,在无穷远处加载电流实施止裂时板内的温度场和应力场。文中利用了复变函数的方法计算得到了电流场、温度场和应力场的分布状态。计算中考虑了材料热传导系数、线胀系数、弹性模量随温度的变化。作为算例,以带有两个共线裂纹、牌号为GH2132GH的高温合金制成的薄板进行了计算,给出了应力、温度与加载的电流密度及裂纹尺寸的关系;分析了导热系数随温度的变化对温度场数值的影响。

     

    Abstract: The temperature and stress fields in a thin plate with collinear cracks are determined in this paper when an electric current is activated to stop crack propagation at remote distance from the cracks. A complex function method is used to find the distribution of the electric current, temperature and stress fields. Temperature dependency for the heat-transfer coefficient, coefficient of linear expansion and the elastic modulus are considered. As an example, the temperature and stress fields of a high temperature alloy (No.GH2132) plate with two collinear cracks is calculated. Relationships between the stress, temperature, electric current density and crack size are obtained. The effect of variation of the heat conductivity factor with temperature on the temperature field is also discussed.

     

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